FPC polyimide film,low shrinkage polyimide film

FPC polyimide film

FPC Polyimide Film has lower shrinkage and good adhesion under the base of polyimide film HN, widely used in manufacturing flexible circuit board, and other fields requiring lower shrinkage and good adhesion.

Characters:

* Lower Shrinkage and can work for a long term under 200℃.

* Excellent dielectric performance.

*Higher mechanical strength, better tear resistance and flexibility.

*Supplied with different width and thickness

Spec.:

Type	FPC-13	FPC-25	FPC-50	FPC-75
Thickness mm	0.013±0.0012	0.025±0.003	0.050±0.005	0.075±0.005
Basic weight g/m2±10%	17.5	35	70	105
Width mm	on customers' demand
Supply size	Supplied in rolls, core diameter: 76mm.

Лcustomization can also be available.

Typical Properties( The follows are just examples not read as guaranteed values)

items	Test methods	Units	Typical Value FPC-13/25/50/75
1. Visua	The surface should be even and free from wrinkle, blister, adhesive particle impurity.
2.Tensile strength	ASTM/D882	MPa	Min.150
3. Elongation	ASTM/D882	%	Min.45
4.Dielectric strength	ASTM/D149	kV/mm	300/280/250/220
5. Vol. Resistivity,	ASTM/D257	Ω.m	> 1 x 1013
6. Surface Resistivity,	ASTM/D257	Ω	> 1 x 1015
7.Dielectric constant5.	ASTM/D150		3.5±0.4
8.Dielectric dissipation factor	ASTM/D150		≤4.0×10-3
9.Dimensional Stability	IPC TM 650,2.2.4A	%	≤0.1/0.1/0.2/0.2
10. Temperature index	UL746B（Mech.）	℃	230
10. Temperature index	UL746B（Elec.）		230
11. Moisture absorption	ASTM/D570	%	≤4.0
12. Flammability	UL-94		V-0
13. Specific Gravity	ASTM/D1505		1.42

Storage:

The product is packed in reinforced carton and sealed in plastic film bag. Please keep dry and in room temperature. Shelf life is 24 months.

Application: FPC polyimide Film is widely used in flexible printed circuit board, etc.

Note: 1.All of above information is based on our best knowledge, not read as guarantees. Right reserved for corrections.

2.Please contact us if customization requirements.

附件