supply ODPA-based polyimide ,thermal plastic polyimide resin,high flexible polymide powder

ODPA-based polyimide resin 002

PIR-002 polyimide resin is unfilled ODPA/ODA-based thermal plastic polyimide resin powder, widely used as matrix resin for shapes,components and parts with excellent physical properties,especially on flexibility due to its ether structure.

(Note:ODPA/ODA abbr. of 4,4'-Oxydiphthalic anhydride/ 4,4'-Oxydianiline)

Base structure:

Characters:

* Good compatibility with fillers:graphite,glass fiber,PTFE,MoS2,etc.

* Excellent flexibility and heat resistance * Low wear and friction

* Excellent dielectric performance. * Excellent chemical resistance.

*Higher mechanical strength, better tear resistance. *Machinable with standard tools

Typical Properties(The follows are just examples not read as guaranteed values)

Items	Test methods	Units	Typical Value
1.Visual	Light yellow for unfilled one
2.Tensile strength 23℃	ASTM/D1708	MPa	90
3. Elongation	ASTM/D1708	%	6.5
4.Flextural strength 23℃	ASTM/D790	Mpa	105
5.Flextural Modulus 23℃	ASTM/D790	Mpa	2900
6.Izod unnotched impact 23℃	IEC179	KJ/m²	175
7.Compressive strength 23℃ 10% strain	ASTM/D695	MPa	110
8. Vol. Resistivity	ASTM/D257	Ω.m	> 1 x 1014
9. Surface Resistivity,	ASTM/D257	Ω	> 1 x 1015
10.Dielectric constant	ASTM/D150		2.5--3.0
11.Coefficient of linear expansion nnsexpansion	ASTM/D696	10-5cm/cm/℃	4.5
12.Friction coefficient	GB3960		0.3
13.Thermal loss (300℃)	TGA	%	Less 0.5%
14. Glass transition temp. Tg	DSC204/1/F	℃	260
15. Specific Gravity	ASTM/D1505		1.4

Packing: carton after sealed by plastic film bag Shelf life: 2 Years

Note: 1.Since polyimide resins are hygroscopic, please predried at 250 °F (120 °C) for a couple of hours before any use

2.All of above information is based on our best knowledge, not read as guarantees. Right reserved for corrections.

3.Please contact us if customization requirements.

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