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PIR-003 Polyimide Resin is unfilled bismaleimide-based soluble polyimide resin powder with excellent heat stability, mechanical and dielectric strength, radiation and chemical resistance,etc.
Base structure:
Application: matrix resin for reinforcement prepreg of fibers(carbon, glass, etc.), mixture with epoxy for heat
resistance, membrane, etc. Before use, dissolve in DMF, etc. for a certain solid content solution.
Properties:
| Visual/Solubility | Fine yellow powder/soluble in DMF,NMP,etc. |
| Purity% | Over 98.5 |
| Gravity | 1.32g/cm3 |
| Gelling time(170℃) | 200--500s |
| Curing temperature(℃)/Pressure(MPa) | 220-230/30-60 |
| Softening temperature（℃） | 90-120 |
| Martin temperature（℃） | 260 |
| TGA260（℃）24hr/300（℃）24hr | Less 1.5% (mainly moisture loss) |
| Tg（℃） | 330 |
| Tensile strength(MPa) | 113.4 |
| Elongation% | Over 5% |
| Surface resistivityΩ | 1 x 1015 |
| Dieletric consistant | 3.5 |
Packing: carton after sealed by plastic film bag Shelf life: 2 Years
Note: 1.Since polyimide resins are hygroscopic, please predried at 250 °F (120 °C) for a couple of hours before any use
2.All of above information is based on our best knowledge, not read as guarantees. Right reserved for corrections.
3.Please contact us if customization requirements.
