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Ultra thin Polyimide Film has ultra thin thickness:3um,5um,7um,etc. ,widely used in manufacturing flexible circuit board, and other fields.
Characters:
*Excellent heat stability, good mechanical strength
*Excellent dielectric performance.
*Radiation and Chemical resistance.
*Supplied with different thickness:3um,5um,7um*standard width:520mm/1040mm
Spec.:
| Type | UTPIF-3 | UTPIF-5 | UTPIF-7 |
| Thickness mm | 0.003±0.003 | 0.005±0.005 | 0.007±0.005 |
| Basic weight g/m2±10% | 4.2 | 7 | 9.8 |
Лcustomization can also be available.
Typical Properties(The follows are just examples not read as guaranteed values)
| Items | Test methods | Units | |
| 1.Visual | The surface should be even and free from wrinkle, blister, adhesive particle impurity. | ||
| 2.Tensile Strength | ASTM/D882 | MPa | Min.300 |
| 3.Elongation | ASTM/D882 | % | Min.15 |
| 4.Dielectric strength | ASTM/D149 | kV/mm | Min.300 |
| 5.Volume Resistivity | ASTM/D257 | Ω.m | > 1 x 1013 |
| 6. Surface Resistivity, | ASTM/D257 | Ω | > 1 x 1015 |
| 7.Dielectric constant | ASTM/D150 | 3.5±0.4 | |
| 8.Dielectric dissipation factor | ASTM/D150 | ≤4.0×10-3 | |
| 9.Dimensional stability | IPC TM 650,2.2.4A | % | ≤0.1 |
| 10. Temperature index | UL746B（Mech.） | ℃ | 230 |
| UL746B（Elec.） | 230 | ||
| 11. Moisture absorption | ASTM/D570 | % | ≤4.0 |
| 12. Flammability | UL-94 | v-0 | |
| 13. Specific Gravity | ASTM/D1505 | 1.42 | |
Storage:
The product is packed in reinforced carton and sealed in plastic film bag. Please keep dry and in room temperature. Shelf life is 24 months.
Application:
Ultra thin polyimide Film is widely used in flexible printed circuit board, etc.
Note: 1.All of above information is based on our best knowledge, not read as guarantees. Right reserved for corrections.
2.Please contact us if customization requirements.